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product offerings
Bergquist’s Thermal Products Group is a world leading developer and manufacturer of thermal management materials which provide product solutions to control and manage heat in electronic assemblies and printed circuit boards. Sil-Pad products are used by many of the world’s largest OEMs in various industries including automotive, computer, power supply, military and motor control. Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard PWB’s. Bergquist Torrington custom air flow products combine aerodynamic, motor and electronic control components into a system engineered and manufactured to meet or exceed each customer’s desired performance.
 
featured product
 
The Bergquist Company developed the Gap Pad thermal interface material family to meet the electronics industry's growing need for interface materials with greater conformability, higher thermal performance and easier application.

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present.
 
 
Gap Pad provides:
  • Elimination of air gaps to reduce thermal resistance
  • High conformability to reduce interfacial resistance
  • Low-stress vibration dampening
  • Compatible with automated dispensing equipment
 
Gap Pad VO Soft
Highly Conformable, Thermally Conductive Material for Filling Air Gaps
Gap Pad VO
Conformable, Thermally Conductive Material for Filling Air Gaps
Gap Pad VO Ultra Soft
Ultra Conformable, Thermally Conductive Material for Filling Air Gaps
Gap Pad 1000SF
Thermally Conductive, Silicone-Free Gap Filling Material
Gap Pad HC1000
“Gel-Like” Modulus Gap Filling Material
Gap Pad 1500
Thermally Conductive, Unreinforced Gap Filling Material
Gap Pad 1500R
Thermally Conductive, Reinforced Gap Filling Material
Gap Pad A2000
High Performance, Thermally Conductive Gap Filling Material
Gap Pad 2000S40
Thermally Conductive, Reinforced “S-Class” Gap Filling Material
Gap Pad 2500S20
Thermally Conductive, Reinforced “S-Class” Gap Filling Material
Gap Pad 2500
Thermally Conductive, Unreinforced Gap Filling Material
Gap Pad A3000
Thermally Conductive, Reinforced Gap Filling Material
Gap Pad 3000S30
Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material
Gap Filler 1000 (Two-Part)
Thermally Conductive, Liquid Gap Filling Material
Gap Filler 1100 SF (Two-Part)
Thermally Conductive, Silicone-Free, Liquid Gap Filling Material
Gap Filler 2000
High Performance Thermally Conductive Liquid Gap Filling Material
Gap Filler 3500S35 (Two-Part)
Thermally Conductive Liquid Gap Filling Material
 
 
more information
www.bergquistcompany.com
 
sales and service
(503) 646-9079
 
 
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